Package structure

ABSTRACT

A package structure includes a backing plate, at least one pad, a frame, a side enclosing plate, a magnetic component and a fixing structure. The backing plate supports a target object. The pad is disposed on the backing plate and fixes the target object. The frame is disposed on a lower side of the backing plate and bonded to the backing plate. The frame supports the backing plate to fix the pad onto the backing plate. The side enclosing plate is disposed around the backing plate and connected to the pad to fix the pad. The magnetic component is disposed on the backing plate and attracting a magnetic coating on the target object. The fixing structure is disposed at an end portion of the frame and connected to the pad to fix the pad.

CROSS REFERENCE TO RELATED APPLICATIONS

This Non-provisional application is a Divisional application (DA) ofU.S. application Ser. No. 16/641,038 and filed on Feb. 21, 2020, whichis the National Stage filing of the International Application No.PCT/CN2017/115899, filed Dec. 13, 2017, which claims priority under 35U.S.C. § 119(a) on Patent Application No(s). 201710734617.X filed inPeople's Republic of China on Aug. 24, 2017, the entire contents ofwhich are hereby incorporated by reference.

BACKGROUND Technical Field

This disclosure relates to a technical field of a package apparatus, andmore particularly to a package structure.

Related Art

When the existing liquid crystal glass panel is being shipped andpackaged, an EPO (Expanded Polyolefin) or EPP (Expanded polypropylene)box is usually used. The EPO/EPP box is made of a foaming material andhas the better buffer property but the lower structural strength thanthose of the metallic and plastic materials. The product tends to bedamaged due to the deformation of the box in the packaging andtransporting processes.

SUMMARY

An objective of this disclosure is to provide a package structure tosolve the problem that the package structure tends to be damaged due tothe deformation of the box in the packaging and transporting processes.

To achieve the above objective, the technical solution of thisdisclosure is to provide a package structure, comprising a backingplate, at least one pad, a frame, and a side enclosing plate. Thebacking plate supports a target object. The pad is disposed on thebacking plate and fixes the target object. The frame is disposed on alower side of the backing plate and bonded to the backing plate, andsupports the backing plate to fix the pad onto the backing plate. Theside enclosing plate is disposed around the backing plate and connectedto the pad to fix the pad.

In one embodiment, the package structure further comprises a magneticcomponent disposed on the backing plate and attracting a magneticcoating on the target object.

In one embodiment, the magnetic component is a magnetic coating or amagnetic insert.

In one embodiment, an end portion of the frame is provided with a fixingstructure connected to the pad to fix the pad.

In one embodiment, the fixing structure comprises a snap disposed on theframe, and a slot snapping with the snap is provided on the pad.

In one embodiment, the fixing structure is an expansion nail forconnecting the frame to the pad, and the pad is provided with a mountingslot for accommodating the expansion nail.

In one embodiment, the expansion nail further comprises a sleeve, asliding bar and a driving unit. The sliding bar is disposed inside thesleeve and slidably fit with the sleeve. The driving unit drives thesliding bar to slide along an axis of the sleeve. The driving unit isdisposed on one end of the sliding bar, and a tapered boss for expandingthe sleeve is disposed on the other end of the sliding bar.

In one embodiment, the driving unit comprises a drive ring and arestricting boss. The drive ring is threadingly connected to the slidingbar, and the restricting boss is disposed on an end portion of thesleeve, and rests against and fit with the drive ring.

In one embodiment, the driving unit comprises a first drive inclinedsurface, drive slider, and a pressing ring. The first drive inclinedsurface is disposed on the sliding bar. The drive slider rests againstthe first drive inclined surface for driving the sliding bar to slide.The pressing ring rests against the driving slider for driving the driveslider to slide. A second drive inclined surface is disposed on thepressing ring for driving the drive slider to move, an accommodatingslot is formed on an end portion of the sleeve for accommodating thedrive slider and the pressing ring, the pressing ring is slidablyconnected to a side surface of the accommodating slot, and the driveslider is slidably connected to a bottom surface of the accommodatingslot.

In one embodiment, the fixing structure comprises a boss disposed on theframe, and a slot engaging with the boss is provided on the pad.

In one embodiment, a buffer pad is disposed on the backing plate, andthe buffer pad is located between the backing plate and the targetobject.

In one embodiment, the side enclosing plate is inserted into and fixedto the pad.

In one embodiment, the frame is a metal frame.

The disclosure further provides a package structure for accommodating atarget object. The package structure comprises a backing plate, at leastone pad, a frame, a side enclosing plate, a magnetic component, and afixing structure. The backing plate supports the target object. The padis disposed on the backing plate and fixes the target object. The frameis disposed on a lower side of the backing plate and bonded to thebacking plate, and supports the backing plate to fix the pad onto thebacking plate. The side enclosing plate is disposed around the backingplate and connected to the pad to fix the pad. The magnetic component isdisposed on the backing plate and attracting a magnetic coating on thetarget object. The fixing structure is disposed at an end portion of theframe and connected to the pad to fix the pad. The package structurecomprises a snap and a slot. The snap is disposed on the frame, and theslot is disposed on the pad and snapping with the snap.

In the package structure provided by this disclosure, the pads aredisposed at the corners of the backing plate and for fixing the targetobject. The fixing is stable. The frame is disposed on the lower side ofthe backing plate. Not only the strength of the backing plate can beimproved, but also the pad can be firmly fixed to the backing plate toprovide the buffer and support effects and ensure that the packagestructure in the transporting process cannot easily deform, has the highstrength, and will not damage the internal target object. The sideenclosing plate is disposed around the backing plate and for enclosingthe circumference of the package structure. The side enclosing plate isconnected to the pad. The mounting strength of the pad can be improved.The side enclosing plate, the backing plate and the pad and the frameconstitute a frame structure. The structural strength of the packagestructure can be improved, so that the stability of the packagestructure in the transporting process can be greatly improved, and theproblem that the target object is damaged in the packaging andtransporting processes can be effectively solved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is first schematic structure view showing a package structureprovided by an embodiment of this disclosure;

FIG. 2 is a schematic structure view taken along a direction A of FIG. 1;

FIG. 3 is a second schematic structure view showing the packagestructure provided by the embodiment of this disclosure;

FIG. 4 is a schematic view showing a connection structure of a sideenclosing plate and a pad used in the embodiment of this disclosure;

FIG. 5 is a second schematic view showing a three-dimensional structureof a frame used in the embodiment of this disclosure;

FIG. 6 is a third schematic view showing the three-dimensional structureof the frame used in the embodiment of this disclosure;

FIG. 7 is a fourth schematic view showing the three-dimensionalstructure of the frame used in the embodiment of this disclosure;

FIG. 8 is a first schematic view showing the three-dimensional structureof an expansion nail used in the embodiment of this disclosure;

FIG. 9 is a main cross-sectional view of FIG. 8 ;

FIG. 10 is a second schematic view showing the three-dimensionalstructure of the expansion nail used in the embodiment of thisdisclosure;

FIG. 11 is a main cross-sectional view of FIG. 10 ; and

FIG. 12 is an enlarged schematic structure view showing a portion B inFIG. 11 .

DETAILED DESCRIPTION OF THE INVENTION

Specific structures and function details disclosed herein are only forthe illustrative purpose for describing the exemplary embodiment of thisdisclosure. However, this disclosure can be specifically implementedthrough many replacements, and should not be explained as beingrestricted to only the embodiment disclosed herein.

In the description of this disclosure, when a first component is “fixedto” or “disposed on” a second component, the first component can bedirectly or indirectly fixed to or disposed on the second component.When a first component is “connected to” a second component, the firstcomponent can be directly or indirectly connected to the secondcomponent.

In the description of this disclosure, it is to be understood that theterms “center”, “transversal”, “up,” “down,” “left,” “right,”“vertical”, “horizontal”, “top,” “bottom,” “inside” and “outside”indicating the orientation or position relationships are the orientationor position relationships based on the drawing, are only provided forthe purposes of describing this disclosure and simplifying thedescription, but do not indicate or imply that the directed devices orelements must have the specific orientations or be constructed andoperated in the specific orientations, and thus cannot be understood asthe restriction to this disclosure.

In addition, the terms “first,” and “second” are used for theillustrative purpose only and cannot be understood as indicating orimplying the relative importance or implicitly specifying the number ofindicated technical features. Therefore, the features restricted by“first” and “second” may expressly or implicitly comprise one ormultiple ones of the features. In the description of this disclosure,unless otherwise described, the meaning of “multiple” comprises two ormore than two. In addition, the terms “comprises” and any modificationthereof intend to cover the non-exclusive inclusions.

Referring to FIGS. 1 to 3 , a package structure provided by thisdisclosure will be described now. The package structure includes: abacking plate 1 for supporting a target object 5; a pad 4 disposed onthe backing plate 1 and for fixing the target object 5; a frame 2disposed on a lower side of the backing plate 1 and bonded to thebacking plate 1 and for supporting the backing plate 1 to fix the pad 4onto the backing plate 1; and a side enclosing plate 3 disposed aroundthe backing plate 1 and connected to the pad 4 to fix the pad 4.

In the package structure provided by this disclosure, the pads 4 aredisposed at the corners of the backing plate 1 and for fixing the targetobject 5. The fixing is stable. The frame 2 is disposed on the lowerside of the backing plate 1. Not only the strength of the backing plate1 can be improved, but also the pad 4 can be firmly fixed to the backingplate 1 to provide the buffer and support effects and ensure that thepackage structure in the transporting process cannot easily deform, hasthe high strength, and will not damage the internal target object 5. Theside enclosing plate 3 is disposed around the backing plate 1 and forenclosing the circumference of the package structure. The side enclosingplate 3 is connected to the pad 4, and the mounting strength of the pad4 can be improved. The side enclosing plate 3, the backing plate 1 andthe pad 4 and the frame 2 constitute a frame structure. The structuralstrength of the package structure can be improved, so that the stabilityof the package structure in the transporting process can be greatlyimproved, and the problem that the target object 5 is damaged in thepackaging and transporting processes can be effectively solved.

In an embodiment, the target object can be fragile articles, such as aliquid crystal panel, a liquid crystal display, a liquid crystal glasspanel, an ordinary glass plate, an OLED, an QLED, a ceramic and thelike, and can be other easily damaged craft items and precious articles,such as an electronic electric apparatus, a meter instrument and thelike.

In one embodiment, the side enclosing plate 3 and the backing plate arehollow plates, a layer of hollow plate is attached to a top surface ofthe frame 2 to serve as a plane support and surround the circumferenceof the box, and the hollow plate provides a buffer function. The pad 4is made of a foaming material, and is optionally an EPP pad. Optionally,a buffer pad is disposed on the backing plate 1, and the buffer pad islocated between the backing plate 1 and the target object 5 toeffectively buffer an external force, and prevent bumping in thetransporting process from damaging the target object 5. In addition,different materials and structures are used according to differentpositions of the package structure, and this ensures the packagingprotection performance of the product and maximizes the reduction of thepackaging costs. The optional frame 2 is the metal frame 2, which isformed by metal stamping and welding and provides the sufficient supportstrength for the package structure. Expanded polypropylene (EPP) is aplastic foaming material. Expanded polyolefin (EPO) hydrocarbon foamingcopolymer consists of 30% polyethylene and 70% polystyrene.

In one embodiment, the corner pads 4 made of the EPP material can beprovided with and positioned according to multiple models of machines toachieve multiple the sharing between the machines, and decrease thedevelopment cost and the time course.

In one embodiment, a package structure provided by this disclosureaccording to a specific implementation method also includes a magneticcomponent, which is disposed on the backing plate 1 and attracts themagnetic coating on the fixed target object 5. The magnetic material iscoated on the target object 5, and on the backing plate 1 at the bottomis also correspondingly coated with the magnetic material or embeddedwith a magnetic pole that attracts the magnetic material on the targetobject 5. After the target object 5 is placed in an aligned manner, thebacking plate 1 and the target object 5 are fixed through the magneticattraction. Optionally, the target object 5 is a liquid crystal glasspanel.

In one embodiment, in order to prevent the liquid crystal glass fromimpacting and damaging the backing plate 1, a thin soft glue may beattached between the backing plate 1 and the liquid crystal glass toprovide the buffer function.

In one embodiment, as a specific aspect of the package structure of thedisclosure, the magnetic component is a magnetic coating or a magneticinsert.

In one embodiment, referring to FIGS. 3 to 12 , as a specific aspect ofthe package structure of the disclosure, an end portion of the frame 2is provided with a fixing structure 21 connected to the pad 4 to fix thepad 4. The pad 4 can be firmly fixed and connected to the frame 2 by theprovision of the fixing structure 21, so that the connection strengthbetween the frame 2 and the pad 4 is better and the use effect is good.

In one embodiment, referring to FIG. 4 , as a specific aspect of thepackage structure of the disclosure, the side enclosing plate 3 isinserted into and fixed to the pad 4, the pad 4 is provided with a slotfor accommodating the side enclosing plate 3, and a position limitingstand 41 engaging with the side enclosing plate 3 is provided in theslot, so that the connection strength of engagement is improved, theconnection effect is good, the connection is stabler, and the assemblyand disassembly are easy.

In one embodiment, referring to FIG. 5 , as a specific aspect of thepackage structure of the disclosure, the fixing structure 21 includes aboss 212 disposed on the frame 2, and a slot engaging with the boss 212is provided on the pad 4. Through the engagement of the boss 212 withthe slot on the pad 4, the boss 212 is disposed on the end portion ofthe frame 2, is located on two sides of the frame 2 and is T-shaped, sothat the engagement effect is good, and the connection strength betweenthe pad 4 and the frame 2 can be ensured. In addition, the pad 4 and theframe 2 are detachably connected together, and can be easilydisassembled. Different materials can be used to perform the separateprocessing followed by the assembling according to different positionsof the package structure, thereby ensuring the packaging protectionperformance of the product and maximizing the reduction of the packagingcosts.

In one embodiment, referring to FIG. 6 , as a specific aspect of thepackage structure of the disclosure, the fixing structure 21 includes asnap 211 disposed on the frame 2, wherein a slot snapping with the snap211 is provided on the pad 4. The snap 211 snapping with the slot on thepad 4 can ensure the connection strength between the pad 4 and the frame2. In addition, the pad 4 and the frame 2 are detachably connectedtogether, and can be easily disassembled. Different materials can beused to perform the separate processing followed by assembling accordingto different positions of the package structure, thereby ensuring thepackaging protection performance of the product and maximizing thereduction of the packaging costs.

In one embodiment, referring to FIGS. 7 to 12 , as a specific aspect ofthe package structure of the disclosure, the fixing structure 21 is anexpansion nail 213 for connecting the frame 2 to the pad 4, and the pad4 is provided with a mounting slot for accommodating the expansion nail213. By mounting the expansion nail 213 in the mounting slot, the frame2 can be quickly connected to the pad 4 to ensure that a stableconnection and an anti-loose effect are always maintained in thetransporting process.

In one embodiment, referring to FIGS. 8 and 9 , as a specific aspect ofthe package structure of the disclosure, the expansion nail 213 includesa sleeve 2131, a sliding bar 2132 disposed inside the sleeve 2131 andslidably fit with the sleeve 2131, and a driving unit 2134 for drivingthe sliding bar 2132 to slide along the axis of the sleeve 2131. Thedriving unit 2134 is disposed on one end of the sliding bar 2132, and atapered boss 2133 for expanding the sleeve 2131 is disposed on the otherend of the sliding bar 2132. The sliding bar 2132 can be pulled by thedriving unit 2134 to slide in the sleeve 2131, the tapered boss 2133squeezes the sleeve 2131, the expansion silk on the sleeve 2131 isspread, and the expansion nail 213 is firmly fixed to the pad 4. Becausethe pad 4 is a soft member, the expansion tube can be adopted for firmfixing. After the expansion silk is spread, it can pierce into the pad4, so that a larger friction force is provided, the fixing effect isgood, and the use is convenient.

In one embodiment, referring to FIGS. 8 and 9 , as a specific aspect ofthe package structure of the disclosure, the driving unit 2134 includesa drive ring 2135 threadingly connected to the sliding bar 2132 and arestricting boss 2137 disposed on the end portion of the sleeve 2131 andresting against and fit with the drive ring 2135. Through therestricting boss 2137 resting against the drive ring 2135, the drivering 2135 is threadingly fit with the sliding bar 2132, and the threadconnection force can pull the sliding bar 2132 in the sleeve 2131, sothat the operation is simple and convenient, and the use effect is good.

In one embodiment, referring to FIGS. 8 and 9 , a drive slot 2136 isprovided on the drive ring 2135. By the provision of the drive slot2136, it is convenient to use the tool to perform a twisting operationon the drive ring 2135.

In one embodiment, referring to FIGS. 10 to 12 , as a specific aspect ofthe package structure of the disclosure, the driving unit 2134 includesa first drive inclined surface 2140 disposed on the sliding bar 2132, adrive slider 2139 resting against the first drive inclined surface 2140,and a pressing ring 2138 for driving the drive slider 2139. A seconddrive inclined surface 2141 for the movement of the drive slider 2139 isdisposed on the pressing ring 2138, and an accommodating slot foraccommodating the drive slider 2139 and the pressing ring 2138 is formedon the end portion of the sleeve 2131. The drive slider 2139 restsagainst the first drive inclined surface 2140 and drives the sliding barto slide. The pressing ring 2138 rests against the drive slider 2139,the pressing ring 2138 is slidably connected to a side surface of theaccommodating slot, and the drive slider 2139 is slidably connected to abottom surface of the accommodating slot. Through the second driveinclined surface 2141 on the pressing ring 2138 squeezing the driveslider 2139, a squeeze surface slidably fit with the second driveinclined surface 2141 is disposed on the drive slider 2139, after thesqueeze surface is forced, the drive slider 2139 is moved in the axialdirection of the sliding bar 2132, the drive slider 2139 squeezes thefirst drive inclined surface 2140 on the sliding bar 2132, and thussqueezes and drives the sliding bar 2132 to slide in the sleeve 2131.Through the tapered boss 2133 squeezing the sleeve 2131, the expansionsilk on the sleeve 2131 is spread, and the expansion nail 213 is firmlyfixed to the pad 4. Upon use, it is only necessary to press the drivering 2135, and the use is easy and convenient.

This disclosure also provides a package structure for accommodating thetarget object 5. The package structure includes: the backing plate 1 forsupporting the target object 5; the pad 4 disposed on the backing plate1 and for fixing the target object 5; the frame 2 disposed on a lowerside of the backing plate 1 and bonded to the backing plate 1 and forsupporting the backing plate 1 to fix the pad 4 onto the backing plate1; the side enclosing plate 3 disposed around the backing plate 1 andconnected to the pad 4 to fix the pad 4; the magnetic component disposedon the backing plate 1 and attracting the magnetic coating on the targetobject 5; and the fixing structure 21 disposed on the end portion of theframe 2 and connected to fix the pad 4; wherein the fixing structure 21includes a snap 211 disposed on the frame 2, and a slot snapping withthe snap 211 is disposed on the pad 4.

In the package structure provided by this disclosure, the pads 4 aredisposed at the corners of the backing plate 1 and for fixing the targetobject 5, the fixing is stable, the frame 2 is disposed on the lowerside of the backing plate 1, not only the strength of the backing plate1 can be improved, but also the pad 4 can be firmly fixed to the backingplate 1 to provide the buffer and support effects and ensure that thepackage structure in the transporting process cannot easily deform, hasthe high strength, and will not damage the internal target object 5. Theside enclosing plate 3 is disposed around the backing plate 1 and forenclosing the circumference of the package structure, the side enclosingplate 3 is connected to the pad 4, the mounting strength of the pad 4can be improved. The side enclosing plate 3, the backing plate 1 and thepad 4 and the frame 2 constitute a frame structure. The structuralstrength of the package structure can be improved. The magnetic materialis coated on the target object 5. The magnetic component with themagnetic pole that attracts the magnetic material on the target object 5is also correspondingly disposed on the bottom backing plate 1. Afterthe target object 5 is placed in an aligned manner, the backing plate 1and the target object 5 are fixed together through the magneticattraction, so that the stability of the package structure in thetransporting process can be greatly improved, and the problem that thetarget object 5 is damaged in the packaging and transporting processescan be effectively solved.

Although the invention has been described with reference to specificembodiments, this description is not meant to be construed in a limitingsense. Various modifications of the disclosed embodiments, as well asalternative embodiments, will be apparent to persons skilled in the art.It is, therefore, contemplated that the appended claims will cover allmodifications that fall within the true scope of the invention.

What is claimed is:
 1. A package structure, comprising: a backing platesupporting a target object; at least one pad disposed on the backingplate and fixing the target object; a frame disposed on a lower side ofthe backing plate, bonded to the backing plate, and supporting thebacking plate to fix the pad onto the backing plate; a side enclosingplate disposed around the backing plate and connected to the pad to fixthe pad; a magnetic component disposed on the backing plate andattracting a magnetic coating on the target object; and a fixingstructure disposed at an end portion of the frame and connected to thepad to fix the pad; wherein the package structure comprises: a snapdisposed on the frame; and a slot disposed on the pad and snapping withthe snap.
 2. The package structure according to claim 1, wherein themagnetic component is a magnetic coating or a magnetic insert.
 3. Thepackage structure according to claim 1, wherein the fixing structure isan expansion nail for connecting the frame to the pad, and the pad isprovided with a mounting slot for accommodating the expansion nail. 4.The package structure according to claim 3, wherein the expansion nailfurther comprises: a sleeve; a sliding bar disposed inside the sleeveand slidably fit with the sleeve; and a driving unit driving the slidingbar to slide along an axis of the sleeve; wherein the driving unit isdisposed on one end of the sliding bar, and a tapered boss for expandingthe sleeve is disposed on the other end of the sliding bar.
 5. Thepackage structure according to claim 4, wherein the driving unitcomprises: the driving unit comprising a drive ring threadinglyconnected to the sliding bar; and a restricting boss disposed on an endportion of the sleeve and resting against and fit with the drive ring.6. The package structure according to claim 4, wherein the driving unitcomprises: a first drive inclined surface disposed on the sliding bar; adrive slider resting against the first drive inclined surface fordriving the sliding bar to slide; and a pressing ring resting againstthe driving slider for driving the drive slider to slide; wherein asecond drive inclined surface is disposed on the pressing ring fordriving the drive slider to move, an accommodating slot is formed on anend portion of the sleeve for accommodating the drive slider and thepressing ring, the pressing ring is slidably connected to a side surfaceof the accommodating slot, and the drive slider is slidably connected toa bottom surface of the accommodating slot.
 7. The package structureaccording to claim 1, wherein a buffer pad is disposed on the backingplate, and the buffer pad is located between the backing plate and thetarget object.